W631GG6KB12K 데이터 시트보기 (PDF) - Winbond

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W631GG6KB12K

1G bits DDR3 SDRAM, organized as 8,388,608 words x 8 banks x 16 bits.

Winbond 

W631GG6KB

 Data masks (DM) for write data

 Programmable CAS Write Latency (CWL) per operating frequency

 Write Latency WL = AL + CWL

 Multi purpose register (MPR) for readout a predefined system timing calibration bit sequence

 System level timing calibration support via write leveling and MPR read pattern

 ZQ Calibration for output driver and ODT using external reference resistor to ground

 Asynchronous RESET# pin for Power-up initialization sequence and reset function

 Programmable on-die termination (ODT) for data, data mask and differential strobe pairs

 Dynamic ODT mode for improved signal integrity and preselectable termination impedances during

writes

 2K Byte page size

 Interface: SSTL_15

 Packaged in WBGA 96 Ball (9X13 mm2), using lead free materials with RoHS compliant

3. ORDER INFORMATION

PART NUMBER

W631GG6KB-11

SPEED GRADE

DDR3-1866 (13-13-13)

W631GG6KB-12 DDR3-1600 (11-11-11)

W631GG6KB12I

W631GG6KB12A

DDR3-1600 (11-11-11)

DDR3-1600 (11-11-11)

W631GG6KB12K DDR3-1600 (11-11-11)

W631GG6KB-15

W631GG6KB15I

DDR3-1333 (9-9-9)

DDR3-1333 (9-9-9)

W631GG6KB15A DDR3-1333 (9-9-9)

W631GG6KB15K DDR3-1333 (9-9-9)

OPERATING TEMPERATURE

0°C ≤ TCASE ≤ 85°C

0°C ≤ TCASE ≤ 85°C

-40°C ≤ TCASE ≤ 95°C

-40°C ≤ TA, TCASE ≤ 95°C

-40°C ≤ TA, TCASE ≤ 105°C

0°C ≤ TCASE ≤ 85°C

-40°C ≤ TCASE ≤ 95°C

-40°C ≤ TA, TCASE ≤ 95°C

-40°C ≤ TA, TCASE ≤ 105°C

Publication Release Date: Feb. 27, 2013

Revision A04

-6-

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