LPC2131 데이터 시트보기 (PDF) - NXP Semiconductors.
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LPC2131
NXP Semiconductors.
LPC2131 Datasheet PDF : 45 Pages
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NXP Semiconductors
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers
One (LPC2131/32) or two (LPC2134/36/38) 8-channel 10-bit ADCs provide a total of
up to 16 analog inputs, with conversion times as low as 2.44 s per channel.
Single 10-bit DAC provides variable analog output (LPC2132/34/36/38).
Two 32-bit timers/external event counters (with four capture and four compare
channels each), PWM unit (six outputs) and watchdog.
Low power Real-time clock with independent power and dedicated 32 kHz clock input.
Multiple serial interfaces including two UARTs (16C550), two Fast I2C-bus (400 kbit/s),
SPI and SSP with buffering and variable data length capabilities.
Vectored interrupt controller with configurable priorities and vector addresses.
Up to forty-seven 5 V tolerant general purpose I/O pins in tiny LQFP64 or HVQFN
package.
Up to nine edge or level sensitive external interrupt pins available.
60 MHz maximum CPU clock available from programmable on-chip PLL with settling
time of 100 s.
On-chip integrated oscillator operates with external crystal in range of 1 MHz to
30 MHz and with external oscillator up to 50 MHz.
Power saving modes include Idle and Power-down.
Individual enable/disable of peripheral functions as well as peripheral clock scaling
down for additional power optimization.
Processor wake-up from Power-down mode via external interrupt or BOD.
Single power supply chip with POR and BOD circuits:
CPU operating voltage range of 3.0 V to 3.6 V (3.3 V 10 %) with 5 V tolerant I/O
pads.
3. Ordering information
Table 1. Ordering information
Type number
Package
Name
Description
LPC2131FBD64/01 LQFP64 plastic low profile quad flat package; 64 leads;
body 10 10 1.4 mm
LPC2132FBD64/01 LQFP64 plastic low profile quad flat package; 64 leads;
body 10 10 1.4 mm
LPC2132FHN64/01 HVQFN64 plastic thermal enhanced very thin quad flat
package; no leads; 64 terminals; body
9 9 0.85 mm
LPC2134FBD64/01 LQFP64 plastic low profile quad flat package; 64 leads;
body 10 10 1.4 mm
LPC2136FBD64/01 LQFP64 plastic low profile quad flat package; 64 leads;
body 10 10 1.4 mm
LPC2138FBD64/01 LQFP64 plastic low profile quad flat package; 64 leads;
body 10 10 1.4 mm
LPC2138FHN64/01 HVQFN64 plastic thermal enhanced very thin quad flat
package; no leads; 64 terminals; body
9 9 0.85 mm
Version
SOT314-2
SOT314-2
SOT804-2
SOT314-2
SOT314-2
SOT314-2
SOT804-2
LPC2131_32_34_36_38
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5.1 — 29 July 2011
© NXP B.V. 2011. All rights reserved.
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