ILD1 데이터 시트보기 (PDF) - Vishay Semiconductors
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ILD1 Datasheet PDF : 11 Pages
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ILD1, ILD2, ILD5, ILQ1, ILQ2, ILQ5
Vishay Semiconductors
AGENCY CERTIFIED/PACKAGE
DUAL CHANNEL
VDE, UL, CSA, BSI, FIMKO
20 to 300
100 to 500
DIP-8
ILD1-X001
ILD2-X001
DIP-8, 400 mil, option 6
-
ILD2-X016
SMD-8, option 7
-
ILD2-X017
SMD-8, option 9
ILD1-X019T
-
DIP-16
-
-
DIP-16, 400 mil, option 6
-
-
SMD-16, option 7
-
-
Notes
• Additional options may be possible, please contact sales office.
(1) Also available in tubes; do not put T on end.
CTR (%)
50 to 400
20 to 300
ILD5-X001
-
-
-
-
-
-
-
-
-
-
-
-
-
QUAD CHANNEL
100 to 500
-
-
-
-
ILQ2-X001
ILQ2-X016
ILQ2-X017T (1)
50 to 400
-
-
-
-
-
-
-
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
PART
SYMBOL
VALUE
UNIT
INPUT
Reverse voltage
Forward current
Surge current
Power dissipation
Derate linearly from 25 °C
VR
IF
IFSM
Pdiss
6
V
60
mA
2.5
A
100
mW
1.3
mW/°C
OUTPUT
Collector emitter reverse voltage
Collector current
Power dissipation
Derate lineary from 25 °C
t < 1 ms
ILD1
ILQ1
ILD2
ILQ2
ILD5
ILQ5
VCEO
VCEO
VCEO
VCEO
VCEO
VCEO
IC
IC
Pdiss
50
V
50
V
70
V
70
V
70
V
70
V
50
mA
400
mA
200
mW
2.6
mW/°C
COUPLER
Isolation test voltage
between emitter and detector
VISO
5300
VRMS
Creepage distance
7
mm
Clearance distance
Isolation resistance
Package power dissipation
Derate linearly from 25 °C
VIO = 500 V, Tamb = 25 °C
VIO = 500 V, Tamb = 100 °C
7
mm
RIO
1012
RIO
1011
Ptot
250
mW
3.3
mW/°C
Storage temperature
Operating temperature
Junction temperature
Soldering temperature (2)
2 mm from case bottom
Tstg
- 40 to + 150
°C
Tamb
- 40 to + 100
°C
Tj
100
°C
Tsld
260
°C
Notes
• Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute
maximum ratings for extended periods of the time can adversely affect reliability.
(1) Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for throught
hole devices (DIP).
Rev. 1.8, 28-Jun-11
2
Document Number: 83646
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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