MS5D3031 데이터 시트보기 (PDF) - Fuji Electric

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제조사

MS5D3031

SILICON DIODE

Fuji Electric 

4. TEST AND INSPECTION

4.1 STANDARD TEST CONDITION

Standard test condition is Ta=25℃、65%R.H.

If judgment is no doubt, the test condition is possible to test in normal condition

Ta=5～35℃、48～85%R.H.

4.2 STRUCTURE INSPECTION

It inspect with eye and measure, Item 2 shall be satisfied.

4.3 FORWARD AND REVERSE CHARACTERISTICS

It inspect on the standard condition, Item 3.2 shall be satisfied.

4.4 TEST

Reference

Test

No.

Test

Items

Testing methods and Conditions

Standard

EIAJ

ED4701

Sampling

number

1 Terminal

Strength

(Tensile)

Pull force : 25N

Force maintaining duration :10±1s

EIAJ

ED4701/401

5

method 1

2 Terminal

Load force : 10N

Strength

EIAJ

Number of times : 2times(90deg./time)

ED4701/401

5

(Bending)

method 3

3 Mounting

Screwing torque value:(M3) : 50±10N・cm EIAJ

Strength

ED4701/402

5

method 2

4 Vibration

Frequency : 100Hz to 2kHz

Acceleration : 100m/s2

Sweeping time : 4min./1 cycle

EIAJ

ED4701/403

5

test code D

4times for each X, Y&Z directions.

5 Shock

Peak amplitude : 15km/s2

Duration time : 0.5ms

3times for each X, Y&Z directions.

EIAJ

ED4701/404

5

test code D

6 Solder ability 1

Solder : Sn-37Pb

Solder temp. : 235±5℃

Immersion time : 5±0.5s

EIAJ

ED4701/303

test code A

5

Apply to flux

Solder ability 2

Solder : Sn-3Ag-0.5Cu

Solder temp. : 245±5℃

5

Immersion time : 5±0.5s

Apply to flux

7 Resistance to Solder temp. : 260±5°C

Soldering

Immersion time : 10±1s

Heat

Number of times : 1times

EIAJ

ED4701/302

5

test code A

Acceptance

number

(0 : 1)

Fuji Electric Device Technology Co.,Ltd.

MS5D3031 4/12

H04-004-03a

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