SAA5540PS 데이터 시트보기 (PDF) - Philips Electronics

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SAA5540PS

TV microcontrollers with Closed Captioning (CC) and On-Screen Display (OSD)

Philips Electronics 

Philips Semiconductors

TV microcontrollers with Closed Captioning (CC)

and On-Screen Display (OSD)

Preliminary specification

SAA55xx

CONTENTS

1

FEATURES

2

GENERAL DESCRIPTION

3

QUICK REFERENCE DATA

4

ORDERING INFORMATION

5

BLOCK DIAGRAM

6

PINNING INFORMATION

6.1

Pinning

6.2

Pin description

7

MICROCONTROLLER

7.1

Microcontroller features

8

MEMORY ORGANIZATION

8.1

ROM bank switching

8.2

RAM organisation

8.3

Data memory

8.4

SFR memory

8.5

Character set feature bits

8.6

External (auxiliary) memory

9

REDUCED POWER MODES

9.1

Idle mode

9.2

Power-down mode

9.3

Standby mode

10

I/O FACILITY

10.1

I/O ports

10.2

Port type

10.3

Port alternative functions

10.4

LED support

11

INTERRUPT SYSTEM

11.1

Interrupt enable structure

11.2

Interrupt enable priority

11.3

Interrupt vector address

11.4

Level/edge interrupt

12

TIMER/COUNTER

13

WATCHDOG TIMER

13.1

Watchdog Timer operation

14

PULSE WIDTH MODULATORS

14.1

PWM control

14.2

Tuning Pulse Width Modulator (TPWM)

14.3

TPWM control

14.4

Software ADC (SAD)

15

I2C-BUS SERIAL I/O

15.1

16

16.1

16.2

16.3

16.4

17

17.1

18

18.1

18.2

18.3

18.4

18.5

18.6

18.7

18.8

18.9

18.10

18.11

18.12

18.13

18.14

18.15

19

20

21

22

23

24

25

26

26.1

26.2

26.3

26.4

27

28

29

I2C-bus port selection

MEMORY INTERFACE

Memory structure

Memory mapping

Addressing memory

Page clearing

DATA CAPTURE

Data Capture features

DISPLAY

Display features

Display modes

Display feature descriptions

Character and attribute coding

Screen and global controls

Text display controls

Display positioning

Character set

ROM addressing

Redefinable characters

Display synchronization

Video/Data switch (Fast Blanking) polarity

Video/data switch adjustment

RGB brightness control

Contrast reduction

MEMORY MAPPED REGISTERS (MMR)

LIMITING VALUES

CHARACTERISTICS

QUALITY AND RELIABILITY

APPLICATION INFORMATION

ELECTROMAGNETIC COMPATIBILITY

(EMC) GUIDELINES

PACKAGE OUTLINES

SOLDERING

Introduction to soldering through-hole mount

packages

Soldering by dipping or by solder wave

Manual soldering

Suitability of through-hole mount IC packages

for dipping and wave soldering methods

DEFINITIONS

LIFE SUPPORT APPLICATIONS

PURCHASE OF PHILIPS I2C COMPONENTS

2000 Feb 23

2

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