MMSZ5221B 데이터 시트보기 (PDF) - CHENG-YI ELECTRONIC CO., LTD.
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MMSZ5221B Datasheet PDF : 4 Pages
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MMSZ5221B THRU MMSZ5262B
PB FREE PRODUCT
500mW SURFACE MOUNT ZENER DIODES
FEATURES
* Planar Die construction
* 500mW Power Dissipation
* Ideally Suited for Automated Assembly Processes
.154(3.90)
.141(3.60)
.110(2.8)
.098(2.5)
MECHANICAL DATA
* Case: SOD-123, Molded Plastic
* Terminals: Solderable per MIL-STD-202E, Method 208
* Polarity: See Diagram Below
* Approx. Weight: 0 . 0 1 grams
* Mounting Position: Any
* Packing information: T/R - 3K per 7" plastic Reel
.004(.10)MAX
.016(.40)MIN
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase half wave, 60Hz, resistive of inductive load.
For capacitive load, derate current by 20%
PARAMETER
SYMBOL
Power Dissipation at Tamb=25℃
PTOT
Pack Forward Surge Current (8.3mS single half)
IFSM
Operating Junction and Storage Temperature Range
TJ ,TS
Valid provided that leads at a distance of 10mm from case kept at ambient temperature.
VALUE
500
4
-55 to +150
UNIT
mW
Amps
℃
PARAMETER
SYMBOL
Min.
Typical Thermal Resistance
RΘJA
-
Forward Voltage Range at IF=100mA
VF
-
Valid provided that leads at a distance of 10mm from case kept at ambient temperature.
Typ.
-
-
Max.
0.3
1.0
Amps
K/mW
V
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