A9213-A 데이터 시트보기 (PDF) - AMIC Technology
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A9213-A Datasheet PDF : 12 Pages
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Rev 1.0
11. Gold Bump Specification
A9213-A
ISO/IEC 14443A RFID TAG IC
․ Bump material:
․ Bump hardness:
․ Bump shear strength:
․ Bump height:
>99.9% pure Au
35 – 80 HV 0.005
>70MPa
18um
․ Bump height uniformly:
– Within a die
– Within a wafer
– Wafer to wafer
․ Bump flatness:
± 2 um
± 3 um
± 4 um
± 1.5 um
․ Bump size:
– ANTP, ANTM:
80um x 80um;
– TIO0 TIO1, TIO2:
60um x 60um
– Variation:
± 5 um
․ Under bump metallization: Sputtered TiW
p10 of 12
Ver. 1.0
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