DATA SHEET
Special Handling Instructions for (FBGA)
Special handling is required for Flash Memory prod-
ucts in FBGA packages.
The package and/or data integrity may be compro-
mised if the package body is exposed to temperatures
above 150°C for prolonged periods of time.
PIN CONFIGURATION
A0–A17 =18 addresses
DQ0–DQ14 =15 data inputs/outputs
DQ15/A-1 =DQ15 (data input/output, word mode),
A-1 (LSB address input, byte mode)
BYTE# =Selects 8-bit or 16-bit mode
CE#
=Chip enable
OE#
=Output enable
WE#
=Write enable
RESET# =Hardware reset pin, active low
RY/BY# =Ready/Busy# output
VCC
=3.0 volt-only single power supply
(see Product Selector Guide for speed
options and voltage supply tolerances)
VSS
=Device ground
NC
=Pin not connected internally
LOGIC SYMBOL
18
A0–A17
16 or 8
DQ0–DQ15
(A-1)
CE#
OE#
WE#
RESET#
BYTE#
RY/BY#
December 4, 2006 21523D4
Am29LV400B
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