PC12310NFZ0F 데이터 시트보기 (PDF) - Sharp Electronics

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PC12310NFZ0F

DIP 4pin Reinforced Insulation Type, High CMR, Low Input Current Photocoupler

Sharp Electronics 

5. SMT Gullwing Lead-Form [ex. PC1231xNIP0F]

Rank mark

Anode mark

1

Factory identification mark

Date code

4

2

1231 3

6.5±0.3

7.62±0.3

4.58±0.3

PC1231xNSZ0F Series

(Unit : mm)

6. SMT Gullwing Lead-Form (VDE option)

[ex. PC1231xYIP0F]

Rank mark

Anode mark

Factory identification mark

Date code

1

4

2

1231 3

4

6.5±0.3

7.62±0.3

SHARP mark "S"

VDE

Indenfication mark

4.58±0.3

1.0+−00.4

Epoxy resin

10.0+−00.5

1.0+−00.4

Product mass : approx. 0.22g

2.54±0.25

1.0+−00.4

Epoxy resin

10.0+−00.5

1.0+−00.4

Product mass : approx. 0.22g

2.54±0.25

7. Wide SMT Gullwing Lead-Form [ex. PC1231xNUP0F]

Rank mark

Anode mark

1

Factory identification mark

Date code

4

8. Wide SMT Gullwing Lead-Form (VDE option)

[ex. PC1231xYUP0F]

Rank mark

Anode mark

Factory identification mark

Date code

1

4

2

1231

3

6.5±0.3

7.62±0.3

4.58±0.3

2

1231 3

4

6.5±0.3

SHARP mark "S"

7.62±0.3

VDE

Indenfication mark

4.58±0.3

0.75±0.25

Epoxy resin

10.16±0.5

12.0MAX

0.75±0.25

Product mass : approx. 0.22g

0.5±0.1

0.75±0.25

Epoxy resin

10.16±0.5

12.0MAX

Product mass : approx. 0.22g

0.75±0.25

0.5±0.1

Plating material : SnCu (Cu : TYP. 2%)

Sheet No.: D2-A02903FEN

3

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