SLVU2.8-4BTG 데이터 시트보기 (PDF) - Littelfuse, Inc
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SLVU2.8-4BTG
Littelfuse, Inc
SLVU2.8-4BTG Datasheet PDF : 4 Pages
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TVS Diode Arrays (SPA™Family of Products)
Lightning Surge Protection - SLVU2.8-4 Series
Product Characteristics
Lead Plating
Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
Substitute Material
Body Material
0.0004 inches (0.102mm)
Silicon
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-203 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Soldering Parameters
Reflow Condition
- Temperature Min (Ts(min))
Pre Heat - Temperature Max (Ts(max))
- Time (min to max) (ts)
Average ramp up rate (Liquidus) Temp
(TL) to peak
TS(max) to TL - Ramp-up Rate
Reflow
- Temperature (TL) (Liquidus)
- Temperature (tL)
Peak Temperature (TP)
Time within 5°C of actual peak
Temperature (tp)
Ramp-down Rate
Time 25°C to peak Temperature (TP)
Do not exceed
Pb – Free assembly
150°C
200°C
60 – 180 secs
5°C/second max
5°C/second max
217°C
60 – 150 seconds
260+0/-5 °C
20 – 40 seconds
5°C/second max
8 minutes Max.
260°C
TP
TL
TS(max)
TS(min)
25
Ramp-up
Preheat
tS
time to peak temperature
tP
Critical Zone
TL to TP
tL
Ramp-down
Time
Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline
Package
Pins
JEDEC
LF
A
o
A1
Recommended
A2
Soldering Pad Outline
(Reference Only)
B
c
D
E
E1
e
L
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
3
Revision: February 15, 2012
SOIC-8
8
MS-012
Millimetres
Inches
Min
Max
Min
Max
1.35
1.75
0.053
0.069
0.10
0.25
0.004
0.010
1.25
1.65
0.050
0.065
0.31
0.51
0.012
0.020
0.17
0.25
0.007
0.010
4.80
5.00
0.189
0.197
5.80
6.20
0.228
0.244
3.80
4.00
0.150
0.157
1.27 BSC
0.050 BSC
0.40
1.27
0.016
0.050
SLVU2.8-4 Series
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