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SFH4580 데이터 시트보기 (PDF) - OSRAM GmbH

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SFH4580 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Empfohlenes Lötpaddesign
Recommended Solder Pad
SFH 4580
5.3 (0.209)
SFH 4580, SFH 4585
Reflow Löten
Reflow Soldering
Bauteil positioniert
Component Location on Pad
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
Lötstopplack
Solder resist
Lötpad
SFH 4585
7 (0.276)
Cu-Fläche > 20 mm 2
Cu-area > 20 mm 2
OHFY2449
5.9 (0.232)
Bauteil positioniert
Component Location on Pad
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
Lötstopplack
Solder resist
Lötpad
(1 (0.039))
1.5 (0.059)
5.2 (0.205)
7 (0.276)
Aussparung 4.85 (0.191) ±0.05 (0.002)
Cu-Fläche > 20 mm 2
Cu-area > 20 mm 2
OHF02450
Maße in mm (inch) / Dimensions in mm (inch).
2009-08-21
7

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