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S25FL032P 데이터 시트보기 (PDF) - Cypress Semiconductor

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S25FL032P
Cypress
Cypress Semiconductor Cypress
S25FL032P Datasheet PDF : 60 Pages
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5. Ordering Information
The ordering part number is formed by a valid combination of the following:
S25FL
032
P
0X
M
F
I
00 1
Packing Type
0 = Tray
1 = Tube
3 = 13” Tape and Reel
Model Number (Additional Ordering Options)
03 = 6 x 4 pin configuration BGA package
02 = 5 x 5 pin configuration BGA package
01 = 8-pin SO package / 8-contact USON package
00 = 16-pin SO package / 8-contact WSON package
Temperature Range
I = Industrial (–40°C to +85°C)
V = Automotive In-cabin (–40°C to +105°C)
A = Automotive, AEC-Q100 Grade 3 (–40°C to +85°C)
n B = Automotive, AEC-Q100 Grade 2 (–40°C to +105°C)
ig Package Materials
s F = Lead (Pb)-free
e H = Low-Halogen, Lead (Pb)-free
D Package Type
M = 8-pin / 16-pin SO package
w N = 8-contact USON / WSON package
e B = 24-ball BGA 6 x 8 mm package, 1.00 mm pitch
N Speed
r 0X = 104 MHz
fo Device Technology
P = 0.09 µm MirrorBit® Process Technology
ed Density
d 032 = 32 Mbit
Device Family
en S25FL
Not Recomm Cypress Memory 3.0 V-only, Serial Peripheral Interface (SPI) Flash Memory
S25FL032P
Document Number: 002-00650 Rev. *L
Page 8 of 60

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