33887(2002) 데이터 시트보기 (PDF) - Motorola => Freescale
부품명
상세내역
제조사
33887 Datasheet PDF : 20 Pages
| |||
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Power Supply Voltage
Normal Operation (Steady-State)
Transient (Note 1)
Input Voltage (Note 2)
FS Status Output (Note 3)
Continuous Output Current (Note 4)
ESD Voltage
Human Body Model (Note 5)
Machine Model (Note 6)
Storage Temperature
Ambient Temperature (Note 7)
Operating Junction Temperature
Lead Soldering Temperature (Note 8)
Approximate Junction-to-Board Thermal Resistance (Note 9)
HSOP
QFN
SO-EP
Symbol
VPWR(SS)
VPWR(t)
VIN
V FS
IOUT(CONT)
VESD1
VESD2
TSTG
TA
TJ
TSOLDER
RθJ-B
Value
36
40
7.0
7.0
6.0
TBD
200
-65 to 150
-40 to 125
-40 to 150
260
~5.0
~18
~12
Unit
V
V
V
A
V
°C
°C
°C
°C
°C/W
Notes:
1. Device will survive the transient overvoltage indicated for a maximum duration of 500 ms.
2. Exceeding the input voltage on IN1, IN2, EN, D1, or D2 may cause a malfunction or permanent damage to the device.
3. Exceeding the pull-up resistor voltage on the open Drain FS pin may cause permanent damage to the device.
4. Continuous output current capability so long as junction temperature is ≤ 150°C.
5. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω).
6. ESD2 testing is performed in accordance with the Machine Model (CZAP = 100 pF, RZAP = 0 Ω).
7. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
8. Lead soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
9. Exposed heat sink pad plus the power and ground terminals comprise the main heat conduction paths. The actual RθJ-B (junction-to-PC
board) values will vary depending on solder thickness and composition and copper trace.
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33887
3
Share Link: 