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FAN3121(2012) 데이터 시트보기 (PDF) - Fairchild Semiconductor

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FAN3121
(Rev.:2012)
Fairchild
Fairchild Semiconductor Fairchild
FAN3121 Datasheet PDF : 20 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Ordering Information
Part Number
Logic
FAN3121CMX_F085 Inverting Channels +
FAN3121TMX_F085 Enable
FAN3122CMX_F085 Non-Inverting Channels +
FAN3122TMX_F085 Enable
Input
Threshold
CMOS
TTL
CMOS
TTL
Package
SOIC-8
SOIC-8
SOIC-8
SOIC-8
Eco
Status
RoHS
RoHS
RoHS
RoHS
Packing Quantity
Method per Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
2,500
2,500
2,500
2,500
For Fairchild’s definition of “green” Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
Package Outline
Figure 3. SOIC-8 (Top View)
Thermal Characteristics(1)
Package
8-Pin Small Outline Integrated Circuit (SOIC)
JL(2)
38
JT(3)
29
JA(4)
87
JB(5)
41
JT(6)
2.3
Units
°C/W
Notes:
1. Estimates derived from thermal simulation; actual values depend on the application.
2. Theta_JL (JL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads
(including any thermal pad) that are typically soldered to a PCB.
3. Theta_JT (JT): Thermal resistance between the semiconductor junction and the top surface of the package,
assuming it is held at a uniform temperature by a top-side heatsink.
4. Theta_JA (ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking,
and airflow. The value given is for natural convection with no heatsink, as specified in JEDEC standards
JESD51-2, JESD51-5, and JESD51-7, as appropriate.
5. Psi_JB (JB): Thermal characterization parameter providing correlation between semiconductor junction
temperature and an application circuit board reference point for the thermal environment defined in Note 4. For
the SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6.
6. Psi_JT (JT): Thermal characterization parameter providing correlation between the semiconductor junction
temperature and the center of the top of the package for the thermal environment defined in Note 4.
© 2012 Fairchild Semiconductor Corporation
FAN3121 / FAN3122_F085 • Rev. 1.0.0
2
www.fairchildsemi.com

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