IAD170P 데이터 시트보기 (PDF) - Clare Inc => IXYS

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상세내역

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IAD170P

Integrated Circuits

Clare Inc => IXYS 

IAD170P

Mechanical Dimensions

16 Pin SOIC (“P” Suffix)

10.160 ± .051

(.400 ± .002)

1.981 TYP.

(.078)

7.493 ± .051

(.295 ± .002)

1.270 TYP.

(.050)

2.108 MAX.

(.083)

1.016

(.040)

7.493 ± .127

(.295 ± .005)

.254

(.010)

10.363 ± .127

(.408 ± .005)

.406 TYP.

(.016)

8.890 TYP.

(.350)

PC Board Pattern

(Top View)

1.270

(.050)

1.193

(.047)

.787

(.031)

9.728 ± .051

(.383 ± .002)

Tape and Reel Packaging for 16 Pin SOIC Package

330.2 DIA.

(13.00)

Top Cover

Tape Thickness

.102 MAX.

(.004)

6.731 MAX.

(.265)

1.753 ± .102

(.069 ± .004)

.406 MAX.

(.016)

7.493 ± .102

(.295 ± .004)

12.090

(.476)

3.175

(.125)

2.007 ± .102 1.498 ± .102 3.987 ± .102

(.079 ± .004) (.059 ± .004) (.157 ± .004)

1 16

16.002 ± .305

(.630 ± .012)

10.693 ± .025

(.421 ± .001)

Embossed Carrier

Embossment

Top Cover

Tape

.050R TYP.

11.989 ± .102

(.472 ± .004)

10.897 ± .025 1.549 ± .102

(.429 ± .001) (.061 ± .004)

User Direction of Feed

Dimensions

mm

(inches)

Rev. 1

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