SAA55XX 데이터 시트보기 (PDF) - Philips Electronics
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SAA55XX Datasheet PDF : 101 Pages
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Philips Semiconductors
Enhanced TV microcontrollers with
On-Screen Display (OSD)
Preliminary specification
SAA55xx
CONTENTS
1
FEATURES
2
GENERAL DESCRIPTION
3
QUICK REFERENCE DATA
4
ORDERING INFORMATION
5
BLOCK DIAGRAM
6
PINNING INFORMATION
6.1
Pinning
6.2
Pin description
7
MICROCONTROLLER
7.1
Microcontroller features
8
MEMORY ORGANIZATION
8.1
ROM bank switching
8.2
Security bits - program and verify
8.3
RAM organisation
8.4
Data memory
8.5
SFR memory
8.6
Character set feature bits
8.7
External (Auxiliary) memory
9
POWER-ON RESET
10
REDUCED POWER MODES
10.1
Idle mode
10.2
Power-down mode
10.3
Standby mode
11
I/O FACILITY
11.1
I/O ports
11.2
Port type
11.3
Port alternative functions
11.4
LED support
12
INTERRUPT SYSTEM
12.1
Interrupt enable structure
12.2
Interrupt enable priority
12.3
Interrupt vector address
12.4
Level/edge interrupt
13
TIMER/COUNTER
14
WATCHDOG TIMER
14.1
Watchdog Timer operation
15
PULSE WIDTH MODULATORS
15.1
PWM control
15.2
Tuning Pulse Width Modulator (TPWM)
15.3
Software ADC (SAD)
16
I2C-BUS SERIAL I/O
16.1
I2C-bus port selection
17
17.1
17.2
17.3
17.4
18
18.1
19
19.1
19.2
19.3
19.4
19.5
19.6
19.7
19.8
19.9
19.10
19.11
19.12
19.13
19.14
19.15
19.16
19.17
20
21
22
23
23.1
23.2
23.3
24
25
26
27
28
28.1
28.2
28.3
28.4
29
30
31
MEMORY INTERFACE
Memory structure
Memory mapping
Addressing memory
Page clearing
DATA CAPTURE
Data Capture features
DISPLAY
Display features
Display modes
Display feature descriptions
Character and attribute coding
Screen and global controls
Screen colour
Text display controls
Soft scroll action
Display positioning
Character set
ROM addressing
Redefinable characters
Display synchronization
Video/data switch (Fast Blanking) polarity
Video/Data switch adjustment
RGB brightness control
Contrast reduction
MEMORY MAPPED REGISTERS (MMR)
LIMITING VALUES
CHARACTERISTICS
QUALITY AND RELIABILITY
Group A
Group B
Group C
APPLICATION INFORMATION
EMC GUIDELINES
REFERENCES
PACKAGE OUTLINE
SOLDERING
Introduction to soldering through-hole mount
packages
Soldering by dipping or by solder wave
Manual soldering
Suitability of through-hole mount IC packages
for dipping and wave soldering methods
DEFINITIONS
LIFE SUPPORT APPLICATIONS
PURCHASE OF PHILIPS I2C COMPONENTS
2000 Feb 23
2
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