BAS16HT1(2004) 데이터 시트보기 (PDF) - ON Semiconductor
부품명
상세내역
제조사
BAS16HT1 Datasheet PDF : 4 Pages
| |||
BAS16HT1
PACKAGE DIMENSIONS
K
A
D
1
2
B
J
L
NOTE 5
H
NOTE 3
SOD−323
CASE 477−02
ISSUE D
E
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F
DRAWING WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS.
5. DIMENSION L IS MEASURED FROM END OF
RADIUS.
MILLIMETERS
DIM MIN MAX
A 1.60 1.80
B 1.15 1.35
C 0.80 1.00
D 0.25 0.40
E
0.15 REF
H 0.00 0.10
J 0.089 0.177
K 2.30 2.70
L 0.075
−−−
INCHES
MIN MAX
0.063 0.071
0.045 0.053
0.031 0.039
0.010 0.016
0.006 REF
0.000 0.004
0.0035 0.0070
0.091 0.106
0.003
−−−
STYLE 1:
PIN 1. CATHODE
2. ANODE
SOLDERING FOOTPRINT*
0.63
0.025
1.60
0.063
2.85
0.112
0.83
0.033
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
3
Share Link: 