TSM150 데이터 시트보기 (PDF) - StarHope
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TSM150 Datasheet PDF : 2 Pages
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PPTC/TSM Series
Features
Surface Mount Devices
Lead free deivce
Size 5045mm/2018 mils
Surface Mount packaging for automated assembly
Agency recognition:
Applications
Almost anywhere there is a low voltage
power supply, up to DC60V and a load
to be protested, including:
Computer mother board, Modem.
Telecommunication equipments
Dimensions (mm)
A
1.5 ±0.1
1.5 ±0.1
B ZZZ
D
C
3.4 ±0.1
Model
TSM030
TSM050
TSM100
TSM100/33
TSM150
TSM200
min
4.44
4.44
4.44
4.44
4.44
4.44
Product dimensions (mm)
A
B
max
min
max
min
4.72
4.22
4.93
0.60
4.72
4.22
4.93
0.60
4.72
4.22
4.93
0.45
4.72
4.22
4.93
0.45
4.72
4.22
4.93
0.45
4.72
4.22
4.93
0.45
C
max
1.10
1.10
0.80
0.80
0.80
0.80
D
min
0.30
0.30
0.30
0.30
0.30
0.30
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Conditions
85℃,1000hrs
85℃,85%℃R.H.,168hrs
85℃,to-40℃,13times
Resistance to solvent
MIL-STD-202,Method 215
Vibration
MIL-STD-202,Method 201
Ambient operating confitions:-40℃ to 85℃
Maximum surface of the device in the tripped state is 125℃
Resistance change
±5% typical
±5% typical
±33% typical
No change
No change
Terminal pad materials
Terminal pad solderability
Termination pad characteristics
Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper
Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
REV.2014.05.01
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