STPS2L40UF 데이터 시트보기 (PDF) - STMicroelectronics
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STPS2L40UF Datasheet PDF : 10 Pages
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STPS2L40
Characteristics
Figure 13. Reverse leakage current versus
reverse voltage applied (typical
values)
IR(mA)
1.E+02
1.E+01
Tj=125°C
Figure 14. Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
1000
F=1MHz
VOSC=30mVRMS
Tj=25°C
1.E+00
1.E-01
1.E-02
1.E-03
0
Tj=25°C
VR(V)
5
10
15
20
25
30
35
40
100
10
1
VR(V)
10
100
Figure 15. Forward voltage drop versus
forward current (high level)
IFM(A)
10.0
Tj=125°C
(typical values)
Tj=125°C
(maxmimum values)
1.0
Tj=25°C
(maximum values)
Figure 16. Forward voltage drop versus
forward current (low level)
IFM(A)
3.0
2.5
Tj=125°C
(typical values)
2.0
1.5
Tj=125°C
(maxmimum values)
1.0
Tj=25°C
(maximum values)
VFM(V)
0.1
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.5
VFM(V)
0.0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
Figure 17.
Thermal resistance junction to
ambient versus copper surface
under each lead, SMB, SMBflat
(epoxy printed board FR4, copper
thickness = 35 µm)
Rth(j-a)(°C/W)
110
100
90
SMB
80
70
60
50
SMBflat
40
30
20
10
SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 18.
Thermal resistance junction to
ambient versus copper surface
under each lead, SMAflat (epoxy
printed board FR4, copper
thickness = 35 µm)
Rth(j-a)(°C/W)
200
180
SMAflat
160
140
120
100
80
60
40
20
SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
5/10
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