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STPS2L40UF 데이터 시트보기 (PDF) - STMicroelectronics

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STPS2L40UF
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STPS2L40UF Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Package Information
2
Package Information
STPS2L40
Epoxy meets UL94,V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Table 5. SMB dimensions
Dimensions
Ref.
Millimeters
Inches
E1
Min.
Max.
Min.
Max.
D
A1 1.90
2.45 0.075 0.096
A2 0.05
0.20 0.002 0.008
b
1.95
2.20 0.077 0.087
E
c
0.15
0.40 0.006 0.016
A1
E
5.10
5.60 0.201 0.220
C
A2
E1 4.05
4.60 0.159 0.181
L
b
D
3.30
3.95 0.130 0.156
L
0.75
1.50 0.030 0.059
Figure 19. SMB footprint dimensions in Figure 20. Marking information
millimeters (inches)
1.62 2.60 1.62
(0.064) (0.102) (0.064)
2.18
(0.086)
5.84
(0.300)
Cathode bar (unidirectional devices only )
e3
xxx
z y ww
e3: ECOPACK ( Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
6/10

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