TE28F640P30T85 데이터 시트보기 (PDF) - Numonyx -> Micron
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TE28F640P30T85 Datasheet PDF : 99 Pages
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P30
Table 3: TSOP Package Dimensions (Sheet 2 of 2)
Product Information
Symbol
Min
Millimeters
Nom
Max
Min
Inches
Nom
Lead Tip Length
L
0.500
0.600
0.700
0.020
0.024
Lead Count
N
-
56
-
-
56
Lead Tip Angle
ý
0°
3°
5°
0°
3°
Seating Plane Coplanarity
Y
-
-
0.100
-
-
Lead to Package Offset
Z
0.150
0.250
0.350
0.006
0.010
Notes:
1.
One dimple on package denotes Pin 1.
2.
If two dimples, then the larger dimple denotes Pin 1.
3.
Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
4.
Daisy Chain Evaluation Unit information is at Numonyx™ Flash Memory Packaging Technology
http://developer.Numonyx.com/design/flash/packtech.
Max
0.028
-
5°
0.004
0.014
3.2
64-Ball Easy BGA Package
Notes
Figure 2: Easy BGA Mechanical Specifications
Ball A1
Corner
D
Ball A1
Corner
S1
12 3 4 5 6 7 8
A
B
C
D
E
E
F
G
H
Top View - Ball side down
8 7 6 5 4 3 21
A
B
C
D
E
F
G
H
Bottom View - Ball Side Up
S2
b
e
A1
A2
A
Seating
Plane
Y
Note: Drawing not to scale
November 2007
Order Number: 306666-11
Datasheet
11
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