CXA1665AM-S 데이터 시트보기 (PDF) - Sony Semiconductor
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CXA1665AM-S Datasheet PDF : 10 Pages
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Package Outline
Unit: mm
CXA1665AM
16PIN SOP (PLASTIC) 300mil
+ 0.4
9.9 – 0.1
16
9
+ 0.4
1.85 – 0.15
0.15
+ 0.2
0.1 – 0.05
1
0.45 ± 0.1
8
1.27
+ 0.1
0.2 – 0.05
CXA1665AM/AM-S
SONY CODE
EIAJ CODE
SOP-16P-L01
∗SOP016-P-0300-A
JEDEC CODE
± 0.12 M
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
PACKAGE WEIGHT
0.2g
CXA1665AM-S
16PIN SOP(PLASTIC)
∗9.7 ± 0.1
16
9
A
+ 0.2
1.25 – 0.1
0.1
1
0.12 M
+ 0.1
0.4 – 0.05
8
1.27
+ 0.05
0.15 – 0.02
0.1 ± 0.1
NOTE: “∗” Dimensions do not include mold protrusion.
0° to 10°
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-16P-L04
SOP016-P-0300
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
SOLDER/PALLADIUM
PLATING
COPPER ALLOY
PACKAGE WEIGHT
0.1g
– 10 –
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