CXL5513M 데이터 시트보기 (PDF) - Sony Semiconductor
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CXL5513M Datasheet PDF : 9 Pages
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Package Outline Unit : mm
CXL5513M
8PIN SOP (PLASTIC)
+ 0.4
5.0 – 0.1
8
5
A
+ 0.4
1.25 – 0.15
0.10
1
+ 0.1
0.4 – 0.05
4
1.27
+ 0.1
0.15 – 0.05
+ 0.15
0.1 – 0.1
SONY CODE
EIAJ CODE
JEDEC CODE
± 0.12 M
SOP-8P-L03
∗SOP008-P-0225-A
0° to 10°
DETAILA
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY / PHENOL RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
42 ALLOY
PACKAGE WEIGHT
0.1g
CXL5513P
8PIN DIP (PLASTIC) 300mil
+ 0.4
9.4 – 0.1
8
5
1
4
2.54
0° to 15°
CXL5513M/P
0.5 ± 0.1
1.2 ± 0.15
SONY CODE
EIAJ CODE
JEDEC CODE
DIP-8P-01
∗DIP008-P-0300-A
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
0.5g
—9—
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