RMBA09501-58(2001) 데이터 시트보기 (PDF) - Raytheon Company
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RMBA09501-58 Datasheet PDF : 6 Pages
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RMBA09501-58
Cellular 2 Watt Linear GaAs MMIC Power
Amplifier
ADVANCED INFORMATION
Test Procedure
for the evaluation board
(RMBA09501-58-TB)
CAUTION: LOSS OF GATE VOLTAGES (VG1, VG2) WHILE CORRESPONDING DRAIN VOLTAGES (Vdd) ARE
PRESENT CAN DAMAGE THE AMPLIFIER.
The following sequence must be followed to properly test the amplifier. (It is necessary to add a fan to provide air
cooling across the heat sink of RMBA09501.) Note: Vdd1, 2 are tied together.
Step 1: Turn off RF input power.
Step 2: Use GND terminal of the evaluation board for
the ground of the DC supplies. Slowly apply
gate supply voltages as specified on results
sheet supplied with test board to the board
terminals Vgg1 and Vgg2.
Step 3: Slowly apply drain supply voltages of +7.0 V to
the board terminals Vdd1, 2. Adjust Vgg to set
the total quiescent current Idq1 and Idq2 (with
no RF applied) Idq as per supplied result sheet.
Gate supply voltages (Vgg i.e., Vgg1, Vgg2)
may be adjusted, only if quiescent current
(Idq1 and Idq2) values desired are different
from those noted on the data summary
supplied with product samples.
Step 4: After the bias condition is established, RF input
signal may now be applied at the appropriate
frequency band and appropriate power level.
Step 5: Follow turn-off sequence of:
(i) Turn off RF Input Power
(ii) Turn down and off drain voltages Vdd1, 2.
(iii) Turn down and off gate voltages Vgg1 and
Vgg2.
Parts List
for Test Evaluation Board
(RMBA09501-58-TB,
G654188/G654942)
Part
C1,C3,C10
C2
C8
C9
C4,C5,C11,C12
C6,C7
L1
L2
L3
R1
W1
U1
P3
P1,P2
Board
R2, R4
R3
R5
Value
47 pF
5.6 pF
6.2 pF
6.8 pF
1000 pF
1.5 uF
5.6 nH
22 nH
39 nH
10 Ohm
26AWG (0.015” dia) Wire
RMBA09501-58, 3.5V PA
Right angle Pin Header
SMA Connectors
FR4
270 ohm
110 ohm
150 ohm
EIA Size
0402
0402
0402
0402
0402
3528
0603
0603
1008
0402
0402
0402
0402
Vendor(s)
Murata, GRM36COG470J050
Murata, GRM36COG5R6B050
Murata, GRM36COG6R2B050
Murata, GRM36COG6R8B050
Murata, GRM36X7R102K050
Kemet (T494B155K020AS)
Toko, LL1608-FH5N6S
Toko, LL608-FH22NK
Coilcraft, 1008HS-390TKBC
IMS, RCI-0402-10R0J
Alpha, 2853/1
Raytheon, G654257
3M (2340-5211TN)
Johnson Components (142-0701-841)
Raytheon Dwg# G654626, V1
IMS RCI 0402 2700J
IMS RCI 0402 1100J
IMS RCI 0402 1500J
Recommendations
for Heat-Sinking the
RMBA09501-58
Use SN92 solder to attach the device to a small copper pedestal at 185°C for 10 seconds. The copper pedestal
should be flush with the top surface of the PWB and be soldered to the rear side of the PWB again using SN92 at
185°C with a sufficient flange to allow attachment of the pedestal, PWB and MMIC to a suitable heat-sink. This
operation will assure that the total thermal resistance of the MMIC to the heat-sink is 13°C/watt and the junction
temperature is below 150°C at a case temperature of 85°C.
www.raytheonrf.com
Characteristic performance data and specifications are subject to change without notice.
Revised November 14, 2001
Page 4
Raytheon RF Components
362 Lowell Street
Andover, MA 01810
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