RMBA09500-58 데이터 시트보기 (PDF) - Raytheon Company

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RMBA09500-58

Cellular 2 Watt Linear GaAs MMIC Power Amplifier

Raytheon Company 

RF Components

Parts List

or Test Evaluation Board

(RMBA09500-58-TB,

G654188/G654942)

RMBA09500-58 - Cellular 2 Watt Linear GaAs

MMIC Power Amplifier

PRODUCT INFORMATION

Part

Value

EIA Size

C1,C3

39 pF

C2,C9

6.8 pF

C8

8.2 pF

C4,C5,C11,C12 1000 pF

C6,C7

4.7 uF

L1

4.7 nH

L2

22 nH

L3

39 nH

R1

10 Ohm

S1, S2

W1

26AWG (0.015” dia) Wire

U1

RMBA09500-58 PA

P3

Right angle Pin Header

P1,P2

Brass SMA Connectors

Board

FR4

C10

100 pF

C13, C14

1.0 uF

0402

0402

0402

0402

3528

0603

0603

1008

0402

0603

0805

Vendor(s)

Murata, GRM36COG390J050

Murata, GRM36COG6R8B050

Murata, GRM36COG8R2B50

Murata, GRM36X7R102K050

TDK, C3216X7R102K050

Toko, LL1608-FH4N7S

Toko, LL1608-FH22NK

Coilcraft, 1008HQ-39NTKBC

IMS, RCI-0402-10R0J

Bar or Ni Ribbon Short

Alpha, 2853/1

Raytheon

3M 2340-5211TN

Johnson Components 142-0701-841

Raytheon Dwg# G654626, V1

Murata, GRM36COG101J50

Murata, GRM39Y5V104Z50

Thermal

Considerations

for Heat-Sinking the

RMBA09500-58

The PWB must be prepared with either an embedded copper slug in the board where the package is to

be mounted or a heat sink should be attached to the backside of the PWB where the package is to be

mounted on the front side. The slug or the heat sink should be made of a highly electrically and

thermally conductive material such as copper or aluminum. The slug should be at least the same

thickness as the PWB. In the case of the heat sink, a small pedestal should protrude through a hole in

the PWB where the package bottom is directly soldered. In either configuration, the top surface of the

slug or the pedestal should be made coplanar with the package lead mounting plane i.e., the top

surface of the PWB. Use Sn96 solder (96.5% Sn and 3.5% Ag) at 220ºC for 20 seconds or less to

attach the heat sink to the backside of the PWB. Then, using Sn63, the package bottom should be

firmly soldered to the slug or the pedestal while the pins are soldered to the respective pads on the front

side of the PWB without causing any stress on the pins. Remove flux completely if used for soldering.

www.raytheonrf.com

Specifications are based on most current or latest revision.

Revised June 27, 2003

Page 4

Raytheon RF Components

362 Lowell Street

Andover, MA 01810

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