HT1602 데이터 시트보기 (PDF) - Holtek Semiconductor
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HT1602 Datasheet PDF : 6 Pages
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Pad Assignment
HT1602
Chip size: 164 × 164 (mil)2
* The IC substrate should be connected to VDD in the PCB layout artwork.
Pad Coordinates
Pad No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
X
–76.23
–76.23
–76.23
–76.23
–76.23
–76.23
–76.23
–76.23
–76.23
–76.23
–76.23
–76.23
–76.23
–66.33
–50.81
–42.26
–33.71
–25.16
Y
76.23
68.13
60.03
51.93
43.83
35.73
–27.63
–35.73
–43.83
–51.93
–60.03
–68.13
–76.23
–76.23
–76.23
–76.23
–76.23
–76.23
Pad No.
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
X
–16.61
–8.10
0.5
9.10
17.60
26.15
34.70
43.25
51.89
75.78
75.78
75.78
75.78
75.78
75.78
75.78
75.78
75.78
Y
–76.23
–76.23
–76.23
–76.23
–76.23
–76.23
–76.23
–76.23
–76.23
–76.23
–67.14
–56.34
–46.62
–35.64
–24.75
–13.32
6.03
33.66
Pad No.
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
X
75.78
75.78
61.20
52.56
43.65
35.10
25.20
15.71
6.66
–3.06
–12.83
–21.60
–32.04
–42.48
–52.92
–62.15
Unit: mil
Y
42.66
61.56
76.23
76.23
76.23
76.23
76.23
76.23
76.23
76.23
76.23
76.23
76.23
76.23
76.23
76.23
2
28th Aug ’98
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