Data Sheet
ADP122/ADP123
JUNCTION TEMPERATURE CALCULATIONS FOR TSOT PACKAGE
140
140
TJ MAX
120
120
ILOAD = 300mA
100
100
TJ MAX
ILOAD = 300mA
80
ILOAD = 150mA
60
ILOAD = 100mA
40
ILOAD = 25mA
20
ILOAD = 1mA
ILOAD = 10mA
0
0.5
1.0
1.5
2.0
2.5
3.0
VOUT – VIN (V)
Figure 38. Junction Temperature vs. Power Dissipation,
500 mm2 of PCB Copper, TA = 25°C
80
ILOAD = 150mA
60
ILOAD = 100mA
40
ILOAD = 25mA
20
ILOAD = 1mA
ILOAD = 10mA
0
0.5
1.0
1.5
2.0
2.5
3.0
VOUT – VIN (V)
Figure 40. Junction Temperature vs. Power Dissipation,
0 mm2 of PCB Copper, TA = 25°C
140
TJ MAX
120
100
ILOAD = 300mA
80
ILOAD = 150mA
60
ILOAD = 100mA
40
ILOAD = 25mA
20
0
0.5
ILOAD = 1mA
ILOAD = 10mA
1.0
1.5
2.0
2.5
3.0
VOUT – VIN (V)
Figure 39. Junction Temperature vs. Power Dissipation,
100 mm2 of PCB Copper, TA = 25°C
140
TJ MAX
120
ILOAD = 300mA
100
ILOAD = 150mA
80
ILOAD = 100mA
60
ILOAD = 25mA
40
ILOAD = 1mA
ILOAD = 10mA
20
0
0.5
1.0
1.5
2.0
2.5
3.0
VOUT – VIN (V)
Figure 41. Junction Temperature vs. Power Dissipation,
500 mm2 of PCB Copper, TA = 50°C
Rev. E | Page 15 of 24