ADP122/ADP123
OUTLINE DIMENSIONS
2.90 BSC
1.60 BSC
5
4
1
2
3
2.80 BSC
*0.90 MAX
0.70 MIN
1.90
BSC
0.95 BSC
*1.00 MAX 0.20
0.08
0.10 MAX
0.50
0.30
8°
SEATING
4°
0.60
PLANE
0°
0.45
0.30
*COMPLIANT TO JEDEC STANDARDS MO-193-AB WITH
THE EXCEPTION OF PACKAGE HEIGHT AND THICKNESS.
Figure 54. 5-Lead Thin Small Outline Transistor Package [TSOT]
(UJ-5)
Dimensions shown in millimeters
PIN 1 INDEX
AREA
0.60
0.55
0.50
SEATING
PLANE
2.00
BSC SQ
1.70
1.60
1.50
4
0.65 BSC
6
0.175 REF
TOP VIEW
0.425
0.350
0.275
EXPOSED
PAD
1.10
1.00
0.90
3
1
BOTTOM VIEW
PIN 1
INDICATOR
(R 0.15)
0.05 MAX
0.02 NOM
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.35
0.30
0.20 REF
0.25
Figure 55. 6-Lead Lead Frame Chip Scale Package [LFCSP_UD]
2.00 mm× 2.00 mm Body, Ultra Thin, Dual Lead
(CP-6-3)
Dimensions shown in millimeters
Data Sheet
Rev. E | Page 20 of 24