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LB1975 데이터 시트보기 (PDF) - SANYO -> Panasonic

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LB1975
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LB1975 Datasheet PDF : 10 Pages
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LB1975
13. Sample calculation for internal power dissipation (approximate)
The calculation assumes the following parameters:
VCC = 5V
VM = 30V
Source-side output transistor ON duty cycle 80% (PWM control)
Output current IO = 1A (RF pin average current)
(1) ICC power dissipation P1
P1 = VCC × ICC = 5V × 14mA = 0.07W
(2) Output drive current power dissipation P2
P2 = VM × 11mA = 30V × 11mA = 0.33W
(3) Source-side output transistor power dissipation P3
P3 = VO(source) × IO × Duty(on) = 0.9V × 1A × 0.8 = 0.72W
(4) Sink-side output transistor power dissipation P4
P4 = VO(sink) × IO = 1.1V × 1A = 1.10W
(5) Total internal power dissipation P
P = P1 + P2 + P3 + P4 = 2.22W
14. IC temperature Rise Measurement
Because the chip temperature of the IC cannot be measured directly, measurement according to one of the following
procedures should always be carried out.
14-1. Thermocouple measurement
A thermocouple element is mounted to the IC heat dissipation fin. This measurement method is easy to implement,
but it will be subject to measurement errors if the temperature is not stable.
14-2. Measurement using internal diode characteristics of IC
This is the recommended measurement method. It makes use of the parasitic diode incorporated in the IC between
FG1 and GND. Set FG1 to High and measure the voltage VF of the parasitic diode to calculate the temperature.
(Sanyo data: for IF = 1mA, VF temperature characteristics are about 2mV/°C)
15. NC Pins
Because NC pins are electrically open, they may be used for wiring purpose etc.
SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using
products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition
ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd.
products described or contained herein.
SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all
semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or
malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise
to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt
safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not
limited to protective circuits and error prevention circuits for safe design, redundant design, and structural
design.
In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are
controlled under any of applicable local export control laws and regulations, such products may require the
export license from the authorities concerned in accordance with the above law.
No part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise,
without the prior written consent of SANYO Semiconductor Co.,Ltd.
Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the
SANYO Semiconductor Co.,Ltd. product that you intend to use.
Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed
for volume production.
Upon using the technical information or products described herein, neither warranty nor license shall be granted
with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third
party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's
intellctual property rights which has resulted from the use of the technical information and products mentioned
above.
This catalog provides information as of December, 2008. Specifications and information herein are subject
to change without notice.
PS No.6087-10/10

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