FAN53601 데이터 시트보기 (PDF) - ON Semiconductor
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FAN53601 Datasheet PDF : 16 Pages
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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above
the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended
exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings
are stress ratings only.
Symbol
Parameter
V IN
V SW
VCTRL
Input Voltage
Voltage on SW Pin
EN and MODE Pin Voltage
Other Pins
ESD
Electrostatic Discharge
Protection Level
Human Body Model per JESD22-A114
Charged Device Model per JESD22-C101
TJ
TSTG
TL
Junction Temperature
Storage Temperature
Lead Soldering Temperature, 10 Seconds
Note :
3. Lesser of 7 V or VIN+0.3 V.
Min. Max.
-0.3
7.0
-0.3
VIN + 0.3(3)
-0.3
VIN + 0.3(3)
-0.3
VIN + 0.3(3)
2.0
1.5
-40
+150
-65
+150
+260
Units
V
V
V
V
kV
°C
°C
°C
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. ON Semiconductor does not recommend
exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
VCC Supply Voltage Range
Output Current for FAN53601
IOUT
Output Current for FAN53611
L
Inductor
CIN
Input Capacitor
COUT
TA
Output Capacitor
Operating Ambient Temperature
TJ
Operating Junction Temperature
Min.
2.3
0
0
1.6
-40
-40
Typ.
470
2.2
4.7
Max.
5.5
600
1
12.0
+85
+125
Units
V
mA
A
nH
µF
µF
°C
°C
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured w ith four-layer 2s2p
boards in accordance to JEDEC standard JESD51. Special attention must be paid to not exceed junction temperature TJ(max) at a
given ambient temperature TA.
Symbol
Parameter
Typical Unit
θJA Junction-to-Ambient Thermal Resistance
125
°C/W
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