CXD1171 데이터 시트보기 (PDF) - Harris Semiconductor
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CXD1171 Datasheet PDF : 8 Pages
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HI1171, CXD1171
Small Outline Plastic Packages (SOIC)
N
INDEX
AREA
H
E
123
L
SEATING PLANE
D
A
e
B
0.24 M
α
A1
C
0.15(0.006)
NOTES:
1. Dimension “D” does not include mold flash, protrusions or gate
burrs.
2. Dimension “E” does not include interlead flash or protrusions.
3. “L” is the length of terminal for soldering to a substrate.
4. “N” is the number of terminal positions.
5. Terminal numbers are shown for reference only.
6. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
M24.2-S
24 LEAD SMALL OUTLINE PLASTIC PACKAGE (200 MIL)
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.067
0.088
1.70
2.25
-
A1
0.002
0.011
0.05
0.30
-
B
0.014
0.021
0.35
0.55
-
C
0.006
0.011
0.15
0.30
-
D
0.587
0.606 14.9
15.4
1
E
0.205
0.220
5.2
5.6
2
e
0.050 BSC
1.27 BSC
-
H
0.296
0.326
7.5
8.3
-
L
0.012
0.027
0.30
0.70
3
N
24
24
4
α
0o
10o
0o
10o
-
Rev. 1 4/95
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