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MC100LVEL11DG

3.3VECL 1:2 Differential Fanout Buffer

ON Semiconductor 

MC100LVEL11

Table 1. PIN DESCRIPTION

Pin

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Q0, Q0; Q1, Q1

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ D, D

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ VCC

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ VEE

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ EP

Function

ECL Data Outputs

ECL Data Inputs

Positive Supply

Negative Supply

Exposed pad must be connected to a sufficient thermal

conduit. Electrically connect to the most negative supply

or leave floating open.

Table 2. ATTRIBUTES

Characteristics

Internal Input Pulldown Resistor

Internal Input Pullup Resistor

ESD Protection

Human Body Model

Machine Model

Charge Device Model

Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)

Flammability Rating

Oxygen Index: 28 to 34

Transistor Count

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

1. For additional information, see Application Note AND8003/D.

Value

75 kW

75 kW

> 4 KV

> 400 V

> 2 kV

Level 1

UL 94 V−0 @ 0.125 in

63

Table 3. MAXIMUM RATINGS

Symbol

VCC

VEE

VI

Iout

TA

Tstg

qJA

qJC

qJA

qJC

qJA

Parameter

PECL Mode Power Supply

NECL Mode Power Supply

PECL Mode Input Voltage

NECL Mode Input Voltage

Output Current

Operating Temperature Range

Storage Temperature Range

Thermal Resistance (Junction−to−Ambient)

Thermal Resistance (Junction−to−Case)

Thermal Resistance (Junction−to−Ambient)

Thermal Resistance (Junction−to−Case)

Thermal Resistance (Junction−to−Ambient)

Condition 1

VEE = 0 V

VCC = 0 V

VEE = 0 V

VCC = 0 V

Continuous

Surge

0 lpfm

500 lpfm

Standard Board

0 lpfm

500 lpfm

Standard Board

0 lfpm

500 lfpm

Condition 2

VI  VCC

VI  VEE

SOIC−8

SOIC−8

SOIC−8

TSSOP−8

TSSOP−8

TSSOP−8

DFN8

DFN8

Rating

8 to 0

−8 to 0

6 to 0

−6 to 0

50

100

−40 to +85

−65 to +150

190

130

41 to 44 ± 5%

185

140

41 to 44 ± 5%

129

84

Units

V

V

V

mA

mA

°C

°C

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

Tsol

Wave Solder

Pb <2 to 3 sec @ 248°C

Pb−Free <2 to 3 sec @ 260°C

265

°C

265

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

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