Philips Semiconductors
UHF power LDMOS transistor
Preliminary specification
BLF1047
PACKAGE OUTLINE
Flanged LDMOST ceramic package; 2 mounting holes; 2 leads
D
SOT541A
Package under
development
Philips Semiconductors reserves the
right to make changes without notice.
A
F
3
D1
U1
B
q
C
c
1
H U2
A
p
E1
E
w1 M A M B M
2
b
w2 M C M
Q
0
5
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT A
b
c
D
D1
E
E1
F
H
p
Q
q
U1 U2 w1 w2
mm
5.74 11.05 0.18 15.39 15.39 10.26 10.29 1.78 20.83 3.43
4.60 10.80 0.10 15.09 15.09 10.06 10.03 1.52 19.81 3.18
2.69
2.44
22.10
27.31
27.05
9.91
9.65
0.25
0.51
inches
0.226
0.181
0.435
0.425
0.007
0.004
0.606
0.594
0.606
0.594
0.404
0.396
0.405
0.395
0.070
0.060
0.820
0.780
0.135
0.125
0.106
0.096
0.87
1.075 0.390
1.065 0.380
0.01
0.02
OUTLINE
VERSION
IEC
SOT541A
2000 Feb 02
REFERENCES
JEDEC
EIAJ
4
EUROPEAN
PROJECTION
ISSUE DATE
99-12-28
00-01-13