74LVC27 데이터 시트보기 (PDF) - NXP Semiconductors.
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74LVC27 Datasheet PDF : 14 Pages
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NXP Semiconductors
74LVC27
Triple 3-input NOR gate
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
c
y
Z
14
8
E
A
X
HE
vM A
pin 1 index
1
e
7
bp
wM
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1) E (2) e
HE
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT402-1
MO-153
L
Lp
Q
v
w
y
Z (1) θ
1
0.75 0.4
0.50 0.3
0.2 0.13 0.1
0.72
0.38
8o
0o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 10. Package outline SOT402-1 (TSSOP14)
74LVC27
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 27 October 2011
© NXP B.V. 2011. All rights reserved.
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