TGA8310-SCC 데이터 시트보기 (PDF) - TriQuint Semiconductor
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TGA8310-SCC Datasheet PDF : 11 Pages
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TGA8310-SCC
MECHANICAL DRAWING
2,3622
(0.0930)
0,1524 0,5944
(0.0060) (0.0234)
1,7882
(0.0704)
4
1,7170
(0.0676)
5
3,9746
(0.1564)
1,9456
(0.0766)
1,2370
(0.0487)
3
0,9423
2
(0.0371)
0,7264
1
(0.0286)
6
0,9119
(0.0359)
7
0,6960
(0.0274)
0
0,1397
0 (0.0055)
8
2,4155
(0.0951)
0,2515
(0.0099)
4,1148
(0.1620)
Units: millimeters (inches)
Thickness: 0,1016 (0.004) (r eference only)
Chip edge to bond pad dimensions are shown to center of bond pad.
Chip size ±0,0508 (0.002)
Bond pad #1 (RF Input):
Bond pad #2 (RF Input):
Bond pad #3 (VCTRL):
Bond pad #4 (VD):
Bond pad #5 (V+):
Bond pad #6 (RF Output):
Bond pad #7 (RF Output):
Bond pad #8 (VG1):
0,0940 x 0,0991 (0.0037 x 0.0039)
0,0940 x 0,0991 (0.0037 x 0.0039)
0,1016 x 0,1524 (0.0040 x 0.0060)
0,1321 x 0,2108 (0.0052 x 0.0083)
0,2032 x 0,1016 (0.0080 x 0.0040)
0,0940 x 0,0991 (0.0037 x 0.0039)
0,0940 x 0,0991 (0.0037 x 0.0039)
0,0965 x 0,0965 (0.0038 x 0.0038)
11
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