SL23EP08SI-1H 데이터 시트보기 (PDF) - Silicon Laboratories

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SL23EP08SI-1H

Low Jitter and Skew 10 to 220 MHz Zero Delay Buffer (ZDB)

Silicon Laboratories 

External Components & Design Considerations

Typical Application Schematic

SL23EP08

CLKIN

1

16

VDD

0.1μF

VDD

0.1μF

4

2

SL23EP08

3

13

VDD

S1

9

S2 8 5

GND

11

12

GND

FBK

CL-4pF

CLKA1

CL

CLKA2

CLKB4

CL

Comments and Recommendations

Decoupling Capacitor: A decoupling capacitor of 0.1μF must be used between VDD and VSS pins. Place the capacitor on

the component side of the PCB as close to the VDD pin as possible. The PCB trace to the VDD pin and to the GND via

should be kept as short as possible. Do not use vias between the decoupling capacitor and the VDD pin.

Series Termination Resistor: A series termination resistor is recommended if the distance between the output clocks and

the load is over 1 ½ inch. The nominal impedance of the clock outputs is given on the page 4. Place the series termination

resistors as close to the clock outputs as possible.

Zero Delay and Skew Control: All outputs and CLKIN pins should be loaded with the same load to achieve “Zero Delay”

between the CLKIN and the outputs. The CLKOUT pin is connected to CLKIN internally on-chip for feedback to PLL, and

sees an additional 4 pF load with respect to Bank A and B clocks. For applications requiring zero input/output delay, the load

at the all output pins including the CLKOUT pin must be the same. If any delay adjustment is required, the capacitance at the

CLKOUT pin could be increased or decreased to increase or decrease the delay between Bank A and B clocks and CLKIN.

For minimum pin-to-pin skew, the external load at all the Bank A and B clocks must be the same.

Rev 1.0, May 18, 2006

Page 11 of 15

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