AN17831A 데이터 시트보기 (PDF) - Unspecified
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AN17831A Datasheet PDF : 9 Pages
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Prepared
Checked
Approved
Product Specifications
AN17831A
Ref No.
F-1
Total Page
9
Page No.
6
(Structure Description)
Chip surface passivation SiN,
PSG,
Others (
Lead frame material
Fe group,
Cu group,
Others (
Inner lead surface process Ag plating, Au plating,
Others (
Outer lead surface process Solder plating, Solder dip,
Others (
Chip mounting method Ag paste,
Au-Si alloy, Solder, Others (
Wire bonding method Thermalsonic bonding,
Others (
Mold material
Epoxy,
Others (
Molding method
Transfer mold, Multiplunger mold, Others (
Fin material
Cu Group
Others (
)1
) 2, 6
)2
)6
)3
)4
)4
)5
)5
Package FP-12S
1
43
2
5
6
Eff. Date Eff. Date
18-FEB-2002
FMSC-PSDA-002-01 Rev.1
Eff. Date Eff. Date
Semiconductor Company, Matsushita Electric Industrial Co., Ltd.
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