FSAV330 데이터 시트보기 (PDF) - ON Semiconductor
부품명
상세내역
제조사
FSAV330 Datasheet PDF : 11 Pages
| |||
Physical Dimensions
10.00
9.80
8.89
16
A
9
B
1.75
6.00
4.00
3.80
5.6
PIN ONE
INDICATOR
1
1.27
(0.30)
8
0.51
0.35
0.25 M C B A
1.27
0.65
LAND PATTERN RECOMMENDATION
1.75 MAX
1.50
1.25
0.25
0.10
C
0.10 C
SEE DETAIL A
0.25
0.19
(R0.10)
(R0.10)
8°
0°
0.90
0.50
(1.04)
0.50
0.25
X 45°
GAGE PLANE
0.36
SEATING PLANE
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC
MS-012, VARIATION AC, ISSUE C.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD
FLASH AND TIE BAR PROTRUSIONS
D) CONFORMS TO ASME Y14.5M-1994
E) LANDPATTERN STANDARD: SOIC127P600X175-16AM
F) DRAWING FILE NAME: M16AREV12.
DETAIL A
SCALE: 2:1
Figure 5. 16-Lead, Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150-inch Narrow
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
© 2002 Fairchild Semiconductor Corporation
FSAV330 • Rev. 1.0.4
6
www.fairchildsemi.com
Share Link: 