PS2631, PS2631L
NOTES AT MOUNTING
(1) NOTES AT MOUNTING BY INFRARED REFLOW SOLDERING
• Peak temperature
: 235 °C or less (resin surface temperature)
• Time
: Within 30 sec. (timing during which resin surface temperature is 210 ˚C or more)
• Number of times of reflow : Three
• Flux
: Rosin flux with little chlorine is recommended.
Reflow Temperature Profile
120 to 160 ˚C
60 to 90 s
(ACTUAL HEAT)
to 10 s
235 ˚C MAX.
210 ˚C
to 30 s
Time (s)
<NOTES>
(1) Please avoid to be remove the residual flux by water after the first reflow processes.
Peak Temperature 235 ˚C or Lower
(2) NOTES AT MOUNTING BY DIP SOLDERING
• Temperature : 260 °C or less
• Time
: Within 10 sec.
• Flux
: Rosin flux with little chlorine is recommended.
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