TGA8810 데이터 시트보기 (PDF) - TriQuint Semiconductor

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TGA8810

Gain Block Amplifier

TriQuint Semiconductor 

RECOMMENDED

ASSEMBLY DIAGRAM

TGA8810-SCC

VD2

68 pF

T.I.P.N. 3022039-1

~2.3nH

RF Input

RF Output

T.I.P.N. 3022039-1

~2.3nH

68 pF

VD1

RF connections: bond using two 1 -mil diameter, 20 to 25 -mil-length gold bond wir es at both RF Input and RF

Output for optimum RF per formance.

Close placement of exter nal components is essential to stability.

Bond using 0 .7-mil diameter wires on bond pads 7, 11, 13, and 14 since they ar e less than the .004 x .004

needed for 1-mil diameter wire.

Two on-chip to on -chip wire bonds are needed for bond pads 1, 2, 3, and 13.

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TriQuint Semiconductor, Inc. • Texas Facilities • (972) 995-8465 • www.triquint.com

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