VEMD10940FX01(2014) 데이터 시트보기 (PDF) - Vishay Semiconductors
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VEMD10940FX01 Datasheet PDF : 6 Pages
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www.vishay.com
1.0
0.9
0.8
0.7
0.6
0.5
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0.3
0.2
0.1
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600
700 800 900 1000 1100
λ - Wavelength (nm)
Fig. 5 - Relative Spectral Sensitivity vs. Wavelength
0° 10° 20°
30°
40°
1.0
50°
0.9
0.8
60°
70°
80°
0.7 0.6 0.4 0.2 0
Fig. 6 - Relative Radiant Sensitivity vs. Angular Displacement-
Horizontal
REFLOW SOLDER PROFILE
Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D
VEMD10940FX01
Vishay Semiconductors
0° 10° 20°
30°
40°
1.0
0.9
50°
0.8
60°
70°
80°
0.7 0.6 0.4 0.2 0
Fig. 7 - Relative Radiant Sensitivity vs. Angular Displacement -
Vertical
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 168 h
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 3, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+5 °C), RH < 5 %.
Rev. 1.0, 21-Feb-14
3
Document Number: 84217
For technical questions, contact: detectortechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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