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ACS1086S 데이터 시트보기 (PDF) - STMicroelectronics

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ACS1086S Datasheet PDF : 11 Pages
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ACS108-6S
Package information
Table 6. SOT-223 Mechanical data
A
A1
V
B
e1
D
B1
HE
4
1
2
3
e
Figure 18. SOT-223 Footprint
Dimensions
Ref.
Millimeters
Inches
c
Min. Typ. Max. Min. Typ. Max.
A
1.80
0.071
A1
0.02
0.001
B 0.60 0.70 0.80 0.024 0.027 0.031
B1 2.90 3.00 3.10 0.114 0.118 0.122
c 0.24 0.26 0.32 0.009 0.010 0.013
D 6.30 6.50 6.70 0.248 0.256 0.264
e
2.3
0.090
e1
4.6
0.181
E 3.30 3.50 3.70 0.130 0.138 0.146
H 6.70 7.00 7.30 0.264 0.276 0.287
V
10° max
3.25
1.32
5.16
7.80
1.32
2.30
0.95
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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