EMP111 데이터 시트보기 (PDF) - Excelics Semiconductor, Inc.
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EMP111 Datasheet PDF : 3 Pages
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UPDATED 10/05/2004
Assembly Drawing
EMP111
7.0 – 9.0 GHz Power Amplifier MMIC
The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line
and separate the wires to minimize the mutual inductance.
CHIP OUTLINE
Chip Size 1130 x 2250 microns
Chip Thickness: 85 ± 13 microns
PAD Dimensions: 100 x 100 microns
All Dimensions in Microns
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
page 3 of 3
Revised October 2004
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