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BTB08-600B 데이터 시트보기 (PDF) - STMicroelectronics

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BTB08-600B Datasheet PDF : 21 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
BTA08, BTB08, T810, T835, T850
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Maximum power dissipation versus on-state
RMS current (full cycle)
Figure 2. RMS on-state current versus temperature (full
cycle)
P(W)
10
9
8
7
6
5
4
3
2
1
IT(RMS)(A)
0
0
1
2
3
4
5
6
7
8
IT(RMS)(A)
10
9
8
7
6
5
4
3
2
1
0
0
25
BTB/T8
BTA
Tc(°C)
50
75
100
125
Figure 3. RMS on-state current versus ambient
temperature (full cycle)
Figure 4. Relative variation of thermal impedance versus
pulse duration
IT(RMS)(A)
3.5
D²PAK
3.0
(S = 1 cm²)
Printed circuit board FR4, copper thickness: 35 µm
2.5
2.0
1.5
DPAK
(S = 0.5 cm²)
1.0
0.5
Tc(°C)
0.0
0
25
50
75
100
125
K = [Zth/Rth]
1E+0
Zth(j-c)
1E-1
1E-2
DPAK/IPAK
Zth(j-a)
TO-220AB/D²PAK
Zth(j-a)
1E-3
1E-3
1E-2
1E-1
tp(s)
1E+0
1E+1
1E+2 5E+2
DS2114 - Rev 15
page 4/21

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