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X28HC64 데이터 시트보기 (PDF) - Renesas Electronics

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X28HC64 Datasheet PDF : 18 Pages
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X28HC64
Absolute Maximum Ratings
Temperature Under Bias
X28HC64 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -10°C to +85°C
X28HC64I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +135°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Voltage on any Pin with Respect to VSS . . . . . . . . . . . . . . . . . . . . .-1V to +7V
DC Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mA
Thermal Information
Thermal Resistance (Typical)
JA (°C/W) JC (°C/W)
32 Ld PLCC Package (Notes 7, 9) . . . . . . .
41
19
28 Ld SOIC Package (Notes 7, 9) . . . . . . . .
46
19
28 Ld PDIP Package (Notes 8, 9) . . . . . . . .
53
21
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493
*Pb-free PDIPs can be used for through hole wave solder processing only.
They are not intended for use in Reflow solder processing applications.
Recommended Operating Conditions
Commercial Temperature Range . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Industrial Temperature Range . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Supply Voltage Range
X28HC64 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
7. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
8. JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
9. For JC, the “case temp” location is taken at the package top center.
DC Electrical Specifications Over recommended operating conditions, unless otherwise specified.
PARAMETER
VCC Current (Active) (TTL Inputs)
SYMBOL
TEST CONDITIONS
ICC CE = OE = VIL, WE = VIH, All I/O’s = open, address
inputs = TTL levels at f = 10MHz
MIN
TYP
MAX
(Note 10) (Note 11) (Note 10) UNIT
15
40
mA
VCC Current (Standby) (TTL Inputs)
ISB1 CE = VIH, OE = VIL All I/O’s = open, other inputs = VIH
1
2
mA
VCC Current (Standby) (CMOS Inputs)
ISB2 CE = VCC - 0.3V, OE = GND, All I/O’s = open, other
inputs = VCC - 0.3V
100
200 µA
Input Leakage Current
ILI
VIN = VSS to VCC
±10 µA
Output Leakage Current
ILO
VOUT = VSS to VCC, CE = VIH
±10 µA
Input LOW Voltage (Note 12)
VlL
-1
0.8
V
Input HIGH Voltage (Note 12)
VIH
2
VCC + 1 V
Output LOW Voltage
VOL IOL = 5mA
0.4
V
Output HIGH Voltage
VOH IOH = -5mA
2.4
V
NOTES:
10. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
11. Typical values are for TA = +25°C and nominal supply voltage.
12. VIL minimum and VIH maximum are for reference only and are not tested.
Endurance and Data Retention The endurance and data retention specifications are established by characterization and are not
production tested.
PARAMETER
MIN
MAX
UNIT
Minimum Endurance
100,000
Cycles
Data Retention
100
Years
FN8109 Rev 4.00
June 27, 2016
Page 9 of 18

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