EL5129 데이터 시트보기 (PDF) - Renesas Electronics
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EL5129 Datasheet PDF : 13 Pages
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EL5129, EL5329
Power Supply Bypassing and Printed Circuit Board
Layout
As with any high frequency device, good printed circuit board
layout is necessary for optimum performance. Ground plane
construction is highly recommended, lead lengths should be as
short as possible, and the power supply pins must be well
bypassed to reduce the risk of oscillation. For normal single
supply operation, where the VS- pin is connected to ground,
one 0.1µF ceramic capacitor should be placed from the VS+
pin to ground. A 4.7µF tantalum capacitor should then be
connected from the VS+ pin to ground. One 4.7µF capacitor
may be used for multiple devices. This same capacitor
combination should be placed at each supply pin to ground if
split supplies are to be used.
Important Note: The metal plane used for heat sinking of
the device is electrically connected to the negative supply
potential (VS-). If VS- is tied to ground, the thermal pad can
be connected to ground. Otherwise, the thermal pad must
be isolated from any other power planes.
FN7430 Rev 1.00
May 13, 2005
Page 11 of 13
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