B57150K1 데이터 시트보기 (PDF) - TDK Corporation

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B57150K1

NTC thermistors for temperature measurement Leadless NTCs

TDK Corporation 

Temperature measurement and compensation

Leadless NTCs

B57150K1

K1150

1.3.1 Solderability (test to IEC 60068-2-58)

Preconditioning: Immersion into flux F-SW 32.

Evaluation criterion: Wetting of soldering areas ≥95%.

Solder

SnPb 60/40

SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)

Bath temperature (°C)

215 ±3

245 ±3

1.3.2 Resistance to soldering heat (test to IEC 60068-2-58)

Preconditioning: Immersion into flux F-SW 32.

Evaluation criterion: Leaching of side edges ≤1/3.

Solder

SnPb 60/40

SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)

Bath temperature (°C)

260 ±5

260 ±5

Dwell time (s)

3 ±0.3

3 ±0.3

Dwell time (s)

10 ±1

10 ±1

Please read Cautions and warnings and

Important notes at the end of this document.

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