BD12730G(2012) 데이터 시트보기 (PDF) - ROHM Semiconductor

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BD12730G
(Rev.:2012)

Low Current Consumption Input/Output Full Swing Operational Amplifier

ROHM Semiconductor 

BD12730G

Datasheet

●Power Dissipation

Power dissipation (total loss) indicates the power that the IC can consume at Ta=25°C (normal temperature). As the IC

consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable

temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and

consumable power.

Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the

thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the

maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold

resin or lead frame of the package. Thermal resistance, represented by the symbol θja°C/W, indicates this heat dissipation

capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.

Figure 34. (a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the

Thermal resistance (θja), given the ambient temperature (Ta), maximum junction temperature (Tjmax), and power

dissipation (Pd).

θja = (Tjmax－Ta) / Pd °C/W

・・・・・ (Ⅰ)

The Derating curve in Figure 34. (b) indicates the power that the IC can consume with reference to ambient temperature.

Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal

resistance (θja), which depends on the chip size, power consumption, package, ambient temperature, package condition,

wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a

reference value measured at a specified condition. Figure 35 (c) shows an example of the derating curve for BD12730.

θja=(Tjmax-Ta)/Pd °C/W

Ambient temperature Ta[ °C ]

Power dissLipSaIのtio消n 費of電LS力I [W]

Pd (max)

P2

θja2 < θja1

θ' ja2

P1

θ ja2

Chip surface temperature Tj[ °C ]

(a) Thermal resistance

θ' ja1 θ ja1

Tj ' (max) Tj (max)

0

25

50

75

100 125 150

Ambient tem周pe囲ra温tu度re Ta [℃ ]

(b) Derating curve

Figure 34. Thermal resistance and Derating Curve

800

600

BD12730G

400

200

0

0

25

50

75

100

AMBIENT TEMPERATURE [℃]

(c) BD12730G

5.4

mW/℃

When using the unit above Ta=25℃, subtract the value above per degree℃. Permissible dissipation is the value

when FR4 glass epoxy board 70mm×70mm×1.6mm (cooper foil area below 3%) is mounted

Figure 35. Derating Curve

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TSZ02201-0RAR1G200600-1-2

30.NOV.2012 Rev.001

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