BD12730G(2012) 데이터 시트보기 (PDF) - ROHM Semiconductor

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BD12730G
(Rev.:2012)

Low Current Consumption Input/Output Full Swing Operational Amplifier

ROHM Semiconductor 

BD12730G

Datasheet

●Operational Notes

1) Processing of unused circuit

VVC+ C

It is recommended to apply the connection (see Figure 36.) and set the

non-inverting input terminal at a potential within the Input Common-mode Voltage

+

Range (Vicm) for any unused circuit.

2) Applied voltage to the input terminal

Connect

to Vicm Vicm

-

For normal circuit operation of voltage comparator, please input a voltage for its

VGENED

input terminal within Input Common-mode Voltage Range (Vicm). Then, regardless of

power supply voltage, GND can be applied to input terminals without

deterioration or destruction of its characteristics.

Figure 36.

Example of an application

3) Operating power supply (split power supply/single power supply)

circuit for unused op-amp

The voltage comparator operates if a certain level of voltage is applied between

V+ and GND. Therefore, the operational amplifier can be operated under

single power supply or split power supply.

4) Power dissipation (Pd)

If the IC is used under excessive power dissipation, an increase in the chip temperature will cause deterioration of the

electrical characteristics of IC. As an example, reduction of current capability may happen. Take consideration of the

effective power dissipation and thermal design with a sufficient margin. Pd is referenced to the provided power dissipation

curve.

5) Short circuits between pins and incorrect mounting

When mounting the IC on a printed circuit board, take notice of the direction and position of the IC. If IC is mounted

erroneously, it may be damaged. Also, when a foreign object is inserted between outputs, between output and V+

terminal, or between output and GND terminal, it causes short circuit which may damage the IC.

6) Usage under strong electromagnetic field

Be careful when using the IC under strong electromagnetic field because it may malfunction.

7) Usage of IC

When pressure is applied to the IC through warp on the printed circuit board, the characteristics may fluctuate due to the

piezo effect. Be careful with the warp on the printed circuit board.

8) Testing IC on the application board

When testing IC on the application board, in cases where the capacitor is connected to low impedance, make sure to

discharge per process because there is a possibility that the IC may be damaged due to stress. When removing IC from

the application board, it is essential to cut the supply voltage. As a countermeasure against the static electricity, observe

proper grounding during fabrication process and take due care when carrying and storing it.

9) The IC destruction caused by capacitive load

The IC may be damaged when V+ terminal and GND terminal is shorted with the charged output terminal capacitor.

When IC is used as an operational amplifier or as an application circuit where oscillation is not activated by an output

capacitor, output capacitor must be kept below 0.1µF in order to prevent the damage mentioned above.

10) Decoupling capacitor

Insert a decoupling capacitor between V+ and GND for stable operation of operational amplifier.

Status of this document

The Japanese version of this document is the formal specification. A customer may use this translated version only for reference

to help in reading the formal version.

If there are any differences in the translated version of this document, the formal version takes priority.

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©2012 ROHM Co., Ltd. All rights reserved.

TSZ22111･15･001

16/18

TSZ02201-0RAR1G200600-1-2

30.NOV.2012 Rev.001

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