AD7175-8 데이터 시트보기 (PDF) - Analog Devices

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AD7175-8

24-Bit, 8-/16-Channel, 250 kSPS, Sigma-Delta ADC with True Rail-to-Rail Buffers

Analog Devices 

AD7175-8

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameter

AVDD1, AVDD2 to AVSS

AVDD1 to DGND

IOVDD to DGND

IOVDD to AVSS

AVSS to DGND

Analog Input Voltage to AVSS

Reference Input Voltage to AVSS

Digital Input Voltage to DGND

Digital Output Voltage to DGND

Analog Input/Digital Input Current

Operating Temperature Range

Storage Temperature Range

Maximum Junction Temperature

Lead Soldering, Reflow Temperature

ESD Rating (Human Body Model)

Rating

−0.3 V to +6.5 V

−0.3 V to +6.5 V

−0.3 V to +6.5 V

−0.3 V to +7.5 V

−3.25 V to +0.3 V

−0.3 V to AVDD1 + 0.3 V

−0.3 V to AVDD1 + 0.3 V

−0.3 V to IOVDD + 0.3 V

−0.3 V to IOVDD + 0.3 V

10 mA

−40°C to +105°C

−65°C to +150°C

150°C

260°C

4 kV

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Data Sheet

THERMAL RESISTANCE

θJA is specified for a device soldered on a JEDEC test board for

surface-mount packages.

Table 4. Thermal Resistance

Package Type

40-Lead, 6 mm × 6 mm LFCSP

θJA

Unit

1-Layer JEDEC Board

114 °C/W

4-Layer JEDEC Board

54 °C/W

4-Layer JEDEC Board with 16 Thermal Vias 34 °C/W

ESD CAUTION

Rev. 0 | Page 8 of 64

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